MoU signed to introduce substrate manufacturing technology in India

Electronics and IT Minister Ashwini Vaishnaw, together with Odisha Chief Minister Mohan Charan Majhi and the CEO of Intel, witnessed the signing of a Memorandum of Understanding (MoU) today to introduce substrate manufacturing technology in India. Mr. Vaishnaw stated that the initiative will further strengthen India’s semiconductor ecosystem. He emphasized that the landmark agreement aligns with the Government’s vision of building a comprehensive semiconductor manufacturing ecosystem in the country.

The MoU was signed between the Government of Odisha, Intel Corporation, and 3DGS Inc., USA, to create a framework for establishing an Advanced Packaging Glass Core Substrate Manufacturing Facility in Odisha. The initiative marks one of the largest high-tech manufacturing investments in India. The proposed facility will be located in the Bhubaneswar-Khurda region.

The project is planned to be executed in phases over a period of five to six years. It is expected to create substantial direct employment opportunities for highly skilled professionals, along with significant indirect jobs across the wider manufacturing and technology sectors.